In this work, hollow glass microsphere reinforced triglycidyl-p-aminophenol (TGPAP) epoxy composites was prepared and the influence of hollow glass microsphere on mechanical and thermal properties of the composites was investigated.
Mechanical behaviors of the composites with various weight fractions of hollow glass microsphere from 0 to 9% were investigated in terms of impact property at both room temperature (RT) and liquid nitrogen temperature (77 K). The fracture surfaces of undoped epoxy and the composites were examined by scanning electron microscopy (SEM).
The results show that both the impact strength at room temperature and 77 K are all enhanced by the addition of hollow glass microsphere with appropriate contents.
Furthermore, the thermal conductivity and coefficients of thermal expansion of undoped epoxy and hollow glass microsphere/epoxy composites were also investigated from 77 K to room temperature.
It is found that the composites show lower thermal conductivity and coefficient of thermal expansion than undoped epoxy. The results indicate that hollow glass microsphere/epoxy composites are promising cryogenic materials.
